3.00 Credits
This course will cover in detail the processing steps used in modifying material properties in nanofabrication. An intensive study of metals used in nanotechnology aids the student in understanding the various methods of metalization such as CVD, evaporation, and sputtering. Metal applications for interconnect technologies will be examined. Aluminum, refactory metals and copper deposition techniques and characterization will be discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, stress effects, and adhesion. Other modification technologies such as ion implementation, diffusion and surface preparation and treatment are integrated as well. An intensive study of dielectric properties and materials including dielectric constant engineering, mechanical, optical, and electrical characteristics, poly, BSG, PSG, SOG, and BPSG gives the student further insight into advanced device fabrication. Material properties and basic device structures will be discussed for the optoelectronic market.
Prerequisite:
TEL 260, TEL 261, TEL 262, and TEL 263