Official website

of the Commonwealth of Pennsylvania

Course Search Results

  • 3.00 Credits

    This course will cover in detail the processing steps used in modifying material properties in nanofabrication. An intensive study of metals used in nanotechnology aids the student in understanding the various methods of metalization such as CVD, evaporation, and sputtering. Metal applications for interconnect technologies will be examined. Aluminum, refactory metals and copper deposition techniques and characterization will be discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, stress effects, and adhesion. Other modification technologies such as ion implementation, diffusion and surface preparation and treatment are integrated as well. An intensive study of dielectric properties and materials including dielectric constant engineering, mechanical, optical, and electrical characteristics, poly, BSG, PSG, SOG, and BPSG gives the student further insight into advanced device fabrication. Material properties and basic device structures will be discussed for the optoelectronic market. Prerequisite:    TEL 260, TEL 261, TEL 262, and TEL 263
  • 3.00 Credits

    This course examines a variety of techniques and measurements essential for controlling device fabrication and final packaging. Students will revisit concepts such as residual gas analysis introduced in TEL 261, optical emission spectroscopy (OES) and end point detection as introduced in TEL 263. Characterization techniques such as surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry, and resistivity/conductivity measurement will be implemented on nanofabricated samples. Basic electrical measurements on device structures for yield analysis and process control will also be stressed. These will include breakdown measurements, junction testing, and C-V and I-V tests and simple transistor characterization. In addition, students will examine mechanical as well as electrical characterizations of nanostructures for biological/biomedical applications. The students will perform DNA analysis by learning and performing the polymerase chain reaction for DNA replication. They will also study and manufacture microfluid channels for biological analysis. An extensive overview of biology will be given with emphasis on biocompatible materials. The students will also learn about the manufacturing issues involved in subjects such as interconnects, isolation, and final device assembly. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing will be emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing and final test for both conventional IC's and novel MEM and biomedical devices will be examined. Prerequisite:    TEL 260, TEL 261, TEL 262, and TEL 263
  • 3.00 Credits

    This course presents an overall view of the telecommunication industry with emphasis on the systems approach. Seven major areas are discussed: basic telecommunication, television, the telephone system, satellite communication, fiber optics, fiber-optic systems and cellular radio. Prerequisite:    TEL 110
  • 4.00 Credits

    RF communications, noise and special communication circuits are introduced first. Various modulation techniques are then discussed in depth. Discussion of radio receivers and transmitters, wave propagation, antennas and transmission lines forms an integral part of this course. Prerequisite:    TEL 301
  • 4.00 Credits

    This course provides a clear and comprehensive introduction into what makes up a data communications system. Topics such as LANS, Packet Switching and ISDN are introduced. Prerequisite:    TEL 301
  • 3.00 Credits

    This course introduces students to the structure, properties, use and design considerations of a variety of materials including ferrous metal, non-ferrous metals, ceramics and polymers. Prerequisite:    New students should complete Placement Testing prior to registration; Visiting students may submit college transcript
  • 3.00 Credits

    This course provides an introduction to the knowledge and skills associated with various conventional chip making machine tools their design, application, set-up and operation. Theory and mathematical concepts and calculations associated with inspection techniques, tapers, digital readout quantifications, speeds, feeds, torque, horsepower, threading, indexing and unit cycle time determination will be covered. Emphasis will be placed on tooling and work holding requirements, and set-up and cutting tool materials (H.S.S., carbide, ceramic and diamond) selection. Additional topics include: an introduction to process planning, quality control charting - Statistical Process Control (SPC) techniques, and Geometric Dimensioning and Tolerancing (GD&T). NOTE: Prerequisites: TME 111 or demonstratable precision measuring instrument familiarization (contact program coordinator). Prerequisite:    TCC 111, TCC 112*, and MAT 128* (*Course(s) May Be Taken Concurrently)
  • 3.00 Credits

    This course introduces students to the basic hands-on technical skills required for skilled trades, manufacturing and other advanced technology trades. Students receive instruction in use of hand and power tools, operation of equipment, use of English and Metric measurement instruments, use of precision measuring instruments, as well as, basic heating, bending and cutting. Prerequisite:    New students should complete Placement Testing prior to registration; Visiting students may submit college transcript
  • 1.00 Credits

    College-Sponsored Experiential Learning (CSEL) is designed to integrate on-the-job learning experiences with classroom studies. These experiences are structured either to explore career options or to prepare for a specific occupation. Students participating in the Cooperative Education and Internship Program gain college credit and are graded for their learning/work experience by the appropriate faculty. Students participating in this 60 hour internship will earn 1 college credit for this experience. Upon successful completion of this hands-on work experience, the student should be able to satisfy instructionally selected competencies from those below according to the number of credits to be awarded. NOTE To be eligible for an internship, students must: Have completed a minimum of 18 or more credits within the last 5 years. Have begun course work in their major (at least 9 credits). Have an overall grade point average (GPA) of 2.5. Obtain a written recommendation by a DCCC faculty within the discipline of the internship. Submit a current resume to the Office of Student Employment Services. Prerequisite:    Internship Requirements: 18 Credits Completed within Last 5 Years; 9 Credits of Course Work in Major; Overall GPA of 2.5 or Higher; Recommendation by DCCC Faculty within Discipline; Resume Submitted to Office of Student Employment Services
  • 2.00 Credits

    College-Sponsored Experiential Learning (CSEL) is designed to integrate on-the-job learning experiences with classroom studies. These experiences are structured either to explore career options or to prepare for a specific occupation. Students participating in the Cooperative Education and Internship Program gain college credit and are graded for their learning/work experience by the appropriate faculty. Students participating in this 120 hour internship will earn 2 college credit for this experience. NOTE To be eligible for an internship, students must: Have completed a minimum of 18 or more credits within the last 5 years Have begun course work in their major (at least 9 credits) Have an overall grade point average (GPA) of 2.5 Obtain a written recommendation by a DCCC faculty within the discipline of the internship Submit a current resume to the Office of Student Employment Services Prerequisite:    Internship Requirements: 18 Credits Completed within Last 5 Years; 9 Credits of Course Work in Major; Overall GPA of 2.5 or Higher; Recommendation by DCCC Faculty within Discipline; Resume Submitted to Office of Student Employment Services
(external site) (opens in a new tab)