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  • 3.00 Credits

    2-2-3 This course provides students with an overview of the basic processing steps in nanofabrication and the equipment processes needed to fabricate devices and structures. Processing flow will be examined for structures such as microelectromechanical (MEM) devices, biomedical "lab-on a-chip structures, display devices and microelectronic devices, including diode, transistor, and full CMOS structures. Prereq: ENGR 210. Coreq: ENGR 211. Prerequisite:    ENGR 210. Coreq: ENGR 211.
  • 3.00 Credits

    2-2-3 This course will cover thin film deposition and etching practices in nanofabrication. The deposition techniques covered will include atmospheric, low pressure, and plasma enhanced chemical vapor deposition. Materials to be considered will include dielectrics, polysilicon, metals, adhesion promoters and diffusion barriers. The second part of the course will focus on etching processes and will emphasize reactive ion etching, high-ion-density reactors, ion beam etching and wet chemical etching. Prereqs: ENGR 210 and 211. Prereq/Coreq: ENGR 212. Prerequisite:    Prereqs: ENGR 210 and 211. Prereq/Coreq: ENGR 212.
  • 3.00 Credits

    2-2-3 This course will cover all aspects of lithography from design and mask fabrication to pattern transfer and inspection. Topics covered will include substrate preparation, the nature and behavior of photoresist materials, exposure, optical masks, aligners, steppers, scanners, control of critical dimensions and profiles, and advanced optical lithography techniques. Prereq: ENGR 210. Pre/Coreqs: ENGR 211 and ENGR 212. Coreq: ENGR 213. Prerequisite:    ENGR 210. Pre/Coreqs: ENGR 211 and ENGR 212. Coreq: ENGR 213.
  • 3.00 Credits

    2-2-3 This course will explore in detail the process steps used in modifying material properties nanofabrication. Included will be growth and annealing processes utilizing horizontal and vertical furnaces as well as rapid thermal annealing. The impact of thermal processing on defects, impurities and overall electrical, mechanical, optical and chemical properties will be studied. The student will grow and measure gate and field oxides, implant and activate source and drain regions, and evaluate thermal budget requirements, using state-of-the-art tools. Ion implant- ation, diffusion and surface preparation and treatment will also be covered. Prereqs: ENGR 210. Pre/Coreqs: ENGR 211, ENGR 212, ENGR 213, ENGR 214. Coreq: ENGR 216. Prerequisite:    Pre/Coreqs: ENGR 211, ENGR 212, ENGR 213, ENGR 214. Coreq: ENGR 216.
  • 3.00 Credits

    2-2-3 This course will examine a variety of techniques and measurements essential for controlling device fabrication and final packaging. Monitoring and characterization techniques will be discussed. Basic electrical measurements on device structures for yield analysis and process control will also be stressed. In addition, the course will examine mechanical and electrical characteristics of simple MEMS devices, and chemical and biological responses of nano- fabricated biomedical structures. Students will also learn about the manufacturing issues involved in topics such as interconnects, isolation and final device assembly. Prereq: ENGR 210. Pre/Coreqs: ENGR 211, ENGR 212, ENGR 213, ENGR 214. Coreq: ENGR 215. Prerequisite:    ENGR 210. Pre/Coreqs: ENGR 211, ENGR 212, ENGR 213, ENGR 214. Coreq: ENGR 215.
  • 3.00 Credits

    3-0-3 Students will learn how to use analytic geometry, differential and integral calculus, and vector algebra in solving engineering problems. They will also learn about the concept of the free-body diagram and its use in conjunction with static equilibrium of forces. The course will focus upon using the deductive process to solve a great variety of problems involving particles and rigid bodies in a state of equilibrium. Prereqs: PHYS 140, MATH 172. Prerequisite:    Prereqs: PHYS 140, MATH 172.
  • 3.00 Credits

    3-0-3 Students will learn how to use calculus-based mathematics in solving engineering problems in dynamics, including problems related to rectilinear and curvilinear motion of rigid bodies and concept of impact, rotation and acceleration of the sytem of rigid bodies in a plane of motion. Offered only in the Spring semester. Prerequisites: ENGR 221, MATH 271. Prerequisite:    ENGR 221, MATH 271.
  • 3.00 Credits

    Interested in developing an entrepreneurial mindset? If you have ever thought of starting your own business, scaling a business venture, or working in a new start-up venture, then this course is designed with you in mind. In this course, students will develop a mindset that will enable them to build a toolkit to create and evaluate entrepreneurial opportunities, gather resources, and build teams nurtured by creativity, leadership, and innovation. Entrepreneurial thinking journeys through the fuzzy, front-end of early-stage entrepreneurial activity.
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