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Course Search Results

  • 3.00 Credits

    Introduces students to the process of developing, implementing, and monitoring individualized instructional strategies. Implementation of Individualized Education Programs (IEP) through goals and objectives is emphasized. Requirement: Ten hours of field experiences and classroom observations.
  • 3.00 Credits

    Emphasizes the role of assistive technology and universal design for learning as a related service in supporting children with exceptionalities in educational environments as a related service. Students identify national, state, and local resources and address legal requirements and funding issues. Students are given the opportunity for hands-on experiences with a wide array of technological devices. Requirement: Ten hours of field experiences and classroom observations.
  • 6.00 Credits

    The course is the culmination of the educational experience of the paraprofessional. This experience allows the student to spend 270 hours in a field placement in an actual classroom under the supervision of the professional certified teacher. The practicum student will be exposed to both inclusive and /or specialized settings to introduce the practicum student to the role and responsibilities of the paraprofessional in relationship to the student, family, and educators. The course supports the acquisition of knowledge and skills for collaboration and positive communication with students and other professionals within diverse learning environments.
  • 3.00 Credits

    Provides an overview of basic Nanofabrication processing equipment and materials handling procedures. The focus is on procedural, safery, environment, and health issues in equipment operation and materials handling. Topics to be covered will include: cleanrooms operations, safety, and health issues; vacuum pump systems operation,environmental, safety, and health issues (covering direct drive mechanical roots blowers, turbomolecular, and dry mechanical systems); furnace operation, safety, environmental, and health issues (covering horizontal, vertical, rapid thermal annealing tools); chemical vapor deposition system operation, safety, environmental, and health issues (covering gas delivery, corrosive and flammabel gas storage and plumbing, regulators, and mass flow controllers); and vacuum deposition/ethching system operation, safety, environmental, and health issues (covering microwave and RF power supplies and tuners, heating and cooling units, vacuum gauges, valves, and process controllers). Specific materials handling issues will include DI water, solvens, cleansers, ion implantation sources, diffusion sources, photoresists, developers, metals, dielectrics, and toxic, flammable, corrosive, and high purity gases as well as packaging materials.
  • 3.00 Credits

    Provides an overview of basic processing steps in Nanofabrication. The majority of the course details a step-by-step description of the equipment and processes needed to fabricate devices and structures. Processing flow will be examined for structures such as microelectromechanical (MEM) devices, biomedical "lab-on-a-chip" structures, display devices, and microelectronic devices including diode, transistor, and full CMOS structures. Students will learn the similarities and differences in both equipment and process flow for each configuration by undertaking "hands-on" processing.
  • 3.00 Credits

    Covers thin film deposition and etching practices in nanofabrication. The deposition techniques to be included in the first part of the course will include atmospheric, low pressure, and plasma enhanced chemical vapor deposition and sputtinger, thermal evaporation, and beam evaporation physical vapor deposition. Materials to be considered will include dielectrics (nitride, oxide), polysilicon (doped and undoped), metals (aluminum, tungsten, copper), adhesion promoters and diffusion barriers. The second part of the course will focus on etching processes and will emphasize reactive ion etching (single, wafer, batch), high-ion-density reactors, ion beam etching and wet chemical etching. Students will receive hands-on experience in depositing and etching dielectric, semiconductor, and metal materials using state-of-the-art tools and practicing many of the steps critical to Nanofabrication of semiconductor devices, including microelectronics, MEMs devices, display structures, and structures used in the biotechnology fields.
  • 3.00 Credits

    Covers all aspects of lithography from design and mask fabrication to pattern transfer and inspection. The course is divided into three major sections. The first section describes the lithographic process from substrate preparation to exposure. Most of the emphasis will be on understanding then nature and behavior of photoresist materials. The second section examines the process from development through inspection (both before and after pattern transfer). This section will introduce optical masks, aligners, steppers and scanners. In addition, critical dimension (CD) control and profile control of photoresists will be investigated. The last section will discuss advanced optical lithographic techniques such as phase shifting masks and illumination schemes as well as e-beam, e-ray, EUV, and ion beam lithography.
  • 3.00 Credits

    Covers in detail the processing steps used in modifying material properties in nanofabrication. Included will be growth and annealing processes utilizing and vertical furnaces as well as rapid thermal annealing. The impact of thermal processing on defects, gettering, impurities and overall electrical, mechanical, optical, electrical and chemical properties will be studied. The student will grow and measure gate and field oxides, implant and activate source and drain regions, and evalute thermal budget requirements using state-of-the-art tools. Included also will be other modification technologies such as ion implantation, diffusion and surface prepatation and treatment. Substrate preparation processing such as slicing, etching, polishing and epitaxial growth will be covered.
  • 3.00 Credits

    Examines a variety of techniques and measurements essential for controlling device fabrication and final packaging. Monitoring techniques such as residual gas analysis (RGA), optical emission spectroscopy (OES) and end point detection will be discussed. Characterization techniques such as: SEM, XPS/Auger, surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry, and resistivity/conductivity measurements will be used on real samples. Basic electrical measurements on device structures for yield analysis and process control will also be stressed. These will include breakdown measurements, junction testings, and C-V and I-V tests and simple transistor characterization. In addition, we will examine mechanical as well electrical characteristics of some simple MEMs devices and chemical and biological responses of nanofabricated biomedical structures. The student will also learn about the manufacturing issues involved in subjects such as interconnects, isolation, and final device assembly. Aluminum, refractory metals and copper depositon techniques and characterization will be discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, stress effects, and adhesion. The importance of planarization techniques such as depostion/etchback adn chemical/mechanical polishing will be emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing and final test for both conventional IC's and novel MEM and biomedical devices will be examined.
  • 3.00 Credits

    This course introduces students to the scientific study of society. We examine the way our society is structured and the social inequalities that shape the lives of different classes, racial and ethnic groups, and genders. We explore how social institutions create these inequalities and how they teach us to understand and take action in our world. We study some of the consequences of globalization for work, wealth, inequality, migration, and social change.
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